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Integrated Circuit Packaging Engineer [Multiple Positions Av

Location: South Bay (Cupertino)         posted: 09.06.22

EMPLOYER:        Apple Inc.


JOB TITLE:          Integrated Circuit Packaging Engineer [Multiple Positions Available]


JOB ID:                1370551


JOB DESCRIPTION: Apple Inc. has multiple positions available for Integrated Circuit Packaging Engineers in Cupertino, California. Architect thermal solutions to address chip energy efficiency and performance scaling. Run Computational Fluid Dynamics (CFD) and heat transfer analysis. Work with cross functional teams on silicon design, system thermal design, and to debug issues. Provide thermal modeling solutions to mobile devices at silicon die and semiconductor package levels. Optimize advanced Integrated Circuit (IC) design scheme/floor-planning for thermal performance. Develop detailed and reduced-order thermal models and analyze simulation and measurement results to enhance product thermal management. Run thermal tests on products to debug thermal related issues and program to enable test and simulation.


CONTACT: To apply, email your resume to:, with reference to Job ID: 1370551. Apple is an Equal Employment Opportunity Employer that is committed to inclusion and diversity. We also take affirmative action to offer employment and advancement opportunities to all applicants, including minorities, women, protected veterans, and individuals with disabilities.

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